Metkon DIMOS Diamond Cutting Wheels for Hard Brittle Materials

These Metkon DIMOS diamond cutting wheels are for use with MICRACUT. These diamond cutting wheels are for use with hard brittle materials such as structural ceramics, boron carbide, boron nitride, and silicon carbide.

• Diameters Available (select when ordering): 127mm (MICRACUT 152), 152mm (MICRACUT 152), 203mm (MICRACUT 200-S/ 202). Please contact us if you need help selecting the appropriate diameter wheel for your application.
• Bond: Metal Bonded
• Arbor: 12.7mm
• Thickness: 127mm = 0.4mm, 152mm = 0.5mm, 203mm = 0.81mm
• Diamond Layer's Dep (X): 127mm = 4mm, 152mm = 4mm, 203mm = 5mm
• Diamond Size / Concentration: 127mm and 152mm: fine/ low, 203mm: fine/ high
• Grain Size (Mesh): 220
• Recommended for Cutting: Hard brittle materials: structural ceramics, boron carbide, boron nitride, and silicon carbide

Metkon Part #s 19-130 (127mm), 19-157 (152mm), 19-205 (203mm).

NOTE: This item is not returnable.

Here is a guide for selecting the appropriate cut-off wheel for your application.