Inspectis BGA Inspection System Basics

This side-view optical BGA inspection system features a 5.0mp USB3.0 digital camera providing reliable and flexible optical inspection and analysis of hidden solder joints of BGA, µBGA, CSP, CGA, FipChip, and top view SMD components. The background fiberoptics light allows for imaging of the first row up to 20 rows of BGA solder bumps. The powerful optics make it possible to obtain images of hidden solder joints down to 40 microns stand off. This system is equipped with Inspectis BGA Basics software featuring tools for image capture, distance measurement, utility, and analysis. View the Inspectis BGA Inspection System ProX. 

• Side-view BGA Lens: 
  • Magnification: ~ 25x - 200x on 24" monitor (on-screen magnification)
  • Working Distance: ~ 0.5 - 25mm (focusing range)
  • Illumination: High power built in pure white LED light source through microprisms.
  • Footprint of standard size probe: 0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)
• Integrated digital camera:
  • Sensor: 1/2.5" CMOS
  • Pixel Size / Resolution: 2.2µm x 2.2µm / 2592(H) x 1944(V) pixels.
  • Interface: USB3.0/USB3.1 Gen 1 (backwards compatible with USB2.0
  • Video Formats: 2592×1944 (5 MP) @15fps, 2000×1500 (3MP)@24fps, 1920×1080 (Full HD)@30fps
  • Controls: Auto/manual white balance, auto/manual exposure, contrast, brightness, frame stacking, gamma, sharpness, high dynamic range, horizontal and vertical flip.
  • Preset/Recall Memories: Two factory set and two user definable with quick access buttons.
  • Preset/Recall calibration magnifications: Five factory set and ten user definable calibrated magnifications with quick access buttons.
  • Image Capture: Snap with switch on device, optional foot-pedal or by software.
  • Software: INSPECTIS©Basics featuring tools for image capture, advance camera controls, measurements, live image view, image comparison and documentation. View details of INSPECTIS software.
  • Video Capture format: JPG, PNG
  • Mount: UNC 1/4"-20
• Illumination: Incident LED light and LED gooseneck brush light. Electronic light intensity control.
• Stand: Large antistatic coated base stand with coarse and fine focus axial rack and pinon, +/-90º pivoting function with soft touch probe protection mechanism. Includes a set of 4 magnetic pegs.
• Environmental Protection: ESD protected with GND connection points on stand bracket and XY-stage.
• Size / Weight: 400(L) 295(W)x 385(H) mm (15.75 x 11.61 x 15.15 inches) / 9.2 kgs (20.28 lbs)
• Storage / Operating Environment: -20º - +60ºC / -5ºC - +40ºC, 20-95% RH, non-condensing
• Computer and Monitor: System includes a computer and 27" UHD / 4K monitor with 3840 x 2160 resolution.
• Carrying Case: Includes aluminum carrying case.
• Manufactured in Sweden.

View the Inspectis BGA Inspection System brochure.

NOTE: This item is not returnable.